-
EUTECTIC DIE BONDER SYSTEM KD100A
※ 좌우 스크롤시 전체내용을 확인하실 수 있습니다.
ITEM Specification Overview • Lead frame (Loader to Unloader) Application • Discrete(TR, DIODE, POWER PKG) Bonding Method • Eutectic bonding Cycle time • TR, Diode : 0.2sec/cycle ~ - Follow the customer process(PKG). Bonding Accuracy • XY ±25㎛ @ 3σ, θ ±1.5° @ 3σ (under vision) - May change depending on material Dimension (W*D*H) • 1,770*1,020*1,330(mm) (Excepted Tower Lamp) • Weight about 1,200kg Utility • AC 220V, 1 Phase(50Hz/60Hz, 7.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(100L/Min)