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LASER DIODE DIE BONDER SYSTEM KD200BX
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LASER DIODE DIE BONDER SYSTEM Laser diode(LD) - TO Header : TO56, TO60, TO38 AuSn Eutectic bonder Laser Diode : 7.8sec/cycle - Optimal condition criteria (May vary depending on condition/environment) [XY] ±10㎛, [θ]±1.0° - Depend on work/chip shape and precision - May change depending on STEM, SUB, LD, COLLET status 1,800*1,200*1,800(mm) (Excepted Tower Lamp) • Weight about 1,200kg AC 220V, 1 Phase(50Hz/60Hz, 2.0kw) • Air: 4~6㎏f /㎠, • N2 GAS : 5kgf/㎠ more than(5L/Min) • VACUUM : -70kPa less then(120L/Min)